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The Union government notified the operational framework for Semicon 2.0, an expanded Rs 1.27 lakh crore programme under the India Semiconductor Mission, on 31 August 2026. Unlike the first phase, the scheme widens eligibility to chip design startups, MSMEs, equipment and materials manufacturers, and research and training institutions, and puts semiconductor design and intellectual property at the centre of the strategy alongside fabrication, assembly and advanced packaging. Silicon wafer fabs can receive support of up to 40 percent of eligible capital expenditure, while chip design startups and MSMEs can access national electronic design automation tools and seed funding of up to Rs 15 crore.